HiLinX

High density modular connector. Possibilities of hybrid inserts, EMI shielding, as well as sealing and rear potting.

HDAS

Monolithic high density PCB interconnect. Provides higher current rate capability, and extreme withstanding to harsh environments.

SMASH

Highly robust advanced SEM E form factor connector. For the most demanding electronic packagings interconnects.

SIAL

Modular PCB interconnect, which provides various combinations of both signal and HF contacts inserts.

SIHD

Monolithic staggered grid connector, with floating capability feature.

HE8/127

Proven legacy product, which meets various worldwide standard. Various features, including a wide range of hardware and locking devices.

HE7-HE9/254

Thermal Clamps

Chassis devices, which both help to dissipate components heating and block the daughter cards into the box slots grooves.